40 CFR 413 - ELECTROPLATING POINT SOURCE CATEGORY
- — General Provisions
- § 413.01 — Applicability and compliance dates.
- § 413.02 — General definitions.
- § 413.03 — Monitoring requirements.
- § 413.04 — Standards for integrated facilities.
- SUBPART A — Electroplating of Common Metals Subcategory (§§ 413.10 - 413.14)
- SUBPART B — Electroplating of Precious Metals Subcategory (§§ 413.20 - 413.24)
- SUBPART C — Electroplating of Speciality Metals Subcategory [Reserved]
- SUBPART D — Anodizing Subcategory (§§ 413.40 - 413.44)
- SUBPART E — Coatings Subcategory (§§ 413.50 - 413.54)
- SUBPART F — Chemical Etching and Milling Subcategory (§§ 413.60 - 413.64)
- SUBPART G — Electroless Plating Subcategory (§§ 413.70 - 413.74)
- SUBPART H — Printed Circuit Board Subcategory (§§ 413.80 - 413.84)
Source: 46 FR 9467, Jan. 28, 1981, unless otherwise noted.
Title 40 published on 2012-07-01
no entries appear in the Federal Register after this date.
This is a list of United States Code sections, Statutes at Large, Public Laws, and Presidential Documents, which provide rulemaking authority for this CFR Part.
This list is taken from the Parallel Table of Authorities and Rules provided by GPO [Government Printing Office].
It is not guaranteed to be accurate or up-to-date, though we do refresh the database weekly. More limitations on accuracy are described at the GPO site.
