40 CFR Appendix Table I-16 to Subpart I of Part 98 - Table I–16 to Subpart I of Part 98—Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing

Manufacturing type/process type/gas	Default DRE (percent)
MEMS, LCDs, and PV Manufacturing	60
Semiconductor Manufacturing:
Plasma Etch/Wafer Clean Process Type:
CF4	75
CH3F	97
CHF3	97
CH2F2	97
C2F6	97
C3F8	97
C4F6	97
C4F8	97
C5F8	97
SF6	97
NF3	96
All other carbon-based plasma etch/wafer clean fluorinated GHG	60
Chamber Clean Process Type:
NF3	88
All other chamber clean fluorinated GHG	60
N2O Processes:
CVD and all other N2O-using processes	60

[78 FR 68234, Nov. 13, 2013]