15- 214 C.M.R. ch. 4, § 8 - Loan repayment
1. Repayment of loans issued under
this Program shall be submitted to the Bond Bank and made in
accordance with the terms set forth in the loan agreement executed by
the Bond Bank and the successful applicant. All repayments received
from borrowers of the program, will be re-deposited into the
revolving loan fund and made available for future year funding
requests.
Notes
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