40 CFR Appendix Table 10 to Subpart WWWW of Part 63 - Table 10 to Subpart WWWW of Part 63—Data Requirements for New and Existing Continuous Lamination Lines and Continuous Casting Lines Complying With a Percent Reduction Limit on a Per Line Basis

Table 10 to Subpart WWWW of Part 63—Data Requirements for New and Existing Continuous Lamination Lines and Continuous Casting Lines Complying With a Percent Reduction Limit on a Per Line Basis

As required in § 63.5865(a), in order to comply with a percent reduction limit for continuous lamination lines and continuous casting lines you must determine the data in the following table:

For each line where the wet-out area . . . And the oven . . . You must determine . . .
1. Has an enclosure that is not a permanent total enclosure (PTE) and the captured organic HAP emissions are controlled by an add-on control device a. Is uncontrolled i. Annual uncontrolled wet-out area organic HAP emissions,
ii. Annual controlled wet-out area organic HAP emissions,
iii. Annual uncontrolled oven organic HAP emissions,
iv. The capture efficiency of the wet-out area enclosure,
v. The destruction efficiency of the add-on control device, and
vi. The amount of neat resin plus and neat gel coat plus applied.
2. Has an enclosure that is a PTE and the captured organic HAP emissions are controlled by an add-on control device a. Is uncontrolled i. Annual uncontrolled wet-out area organic HAP emissions,
ii. Annual controlled wet-out area organic HAP emissions,
iii. Annual uncontrolled oven organic HAP emissions,
iv. That the wet-out area enclosure meets the requirements of EPA Method 204 of appendix M to 40 CFR part 51 for a PTE,
v. The destruction efficiency of the add-on control device, and
vi. The amount of neat resin plus and neat gel coat plus applied.
3. Is uncontrolled a. Is controlled by an add-on control device i. Annual uncontrolled wet-out area organic HAP emissions,
ii. Annual uncontrolled oven organic HAP emissions,
iii. Annual controlled oven organic HAP emissions,
iv. The capture efficiency of the oven,
v. the destruction efficiency of the add-on control device, and
vi. the amount of neat resin plus and neat gel coat plus applied.
4. Has an enclosure that is not a PTE and the captured organic HAP emissions are controlled by an add-on control device a. Is controlled by an add-on control device i. Annual uncontrolled wet-out area organic HAP emissions,
ii. Annual controlled wet-out area organic HAP emissions,
iii. Annual uncontrolled oven organic HAP emissions,
iv. Annual controlled oven organic HAP emissions;
v. The capture efficiency of the wet-out area enclosure,
vi. Inlet organic HAP emissions to the add-on control device,
vii. Outlet organic HAP emissions from the add-on control device, and
viii. The amount of neat resin plus and neat gel coat plus applied.
5. Has an enclosure that is a PTE and the captured organic HAP emissions are controlled by an add-on control device a. Is controlled by an add-on control device i. That the wet-out area enclosure meets the requirements of EPA Method 204 of appendix M to 40 CFR part 51 for a PTE,
ii. The capture efficiency of the oven, and
iii. The destruction efficiency of the add-on control device.