40 CFR Appendix Table I-18 to Subpart I of Part 98 - Default Factors for Gamma (gi,p and gk,i,p) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method

Table I-18 to Subpart I of Part 98—Default Factors for Gamma (gi,p and gk,i,p) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method

Process type	In-situ thermal or in-situ plasma cleaning					Remote plasma cleaning
Gas	CF4	C2F6	c-C4F8	NF3	SF 6	C3F8	CF4	NF3
If manufacturing wafer sizes ≤200 mm AND manufacturing 300 mm (or greater) wafer sizes
g i	13	9.3	4.7	14	11	NA	NA	5.7
g CF4,i	NA	23	6.7	63	8.7	NA	NA	58
g C2F6,i	NA	NA	NA	NA	3.4	NA	NA	NA
g CHF3,i	NA	NA	NA	NA	NA	NA	NA	0.24
g CH2F2,i	NA	NA	NA	NA	NA	NA	NA	111
g CH3F,i	NA	NA	NA	NA	NA	NA	NA	33
If manufacturing ≤200 mm OR manufacturing 300 mm (or greater) wafer sizes
g i (≤ 200 mm wafer size)	13	9.3	4.7	2.9	11	NA	NA	1.4
g CF4,i (≤200 mm wafer size)	NA	23	6.7	110	8.7	NA	NA	36
g C2F6,i (≤200 mm wafer size)	NA	NA	NA	NA	3.4	NA	NA	NA
g i (300 mm wafer size)	NA	NA	NA	26	NA	NA	NA	10
g CF4,i (300 mm wafer size)	NA	NA	NA	17	NA	NA	NA	80
g C2F6,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	NA
g CHF3,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	0.24
g CH2F2,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	111
g CH3F,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	33

* If you manufacture MEMS or PVs and use semiconductor tools and processes, you may use the corresponding g in this table. For all other tools and processes, a default g of 10 must be used.

[89 FR 31922, Apr. 25, 2024]